SAWSTREET LLCOrlando, Florida

SAWSTREET LLC
407-601-4907 x101
10501 S Orange Ave Ste 115 Orlando, FL 32824-7738

Products & Services

SawStreet provides backend services that include Grinding, Polishing, Dicing, Pick & Place, and Inspection. SawStreet handless low to mid volume, specializing in quick turn requirements. Additional services include managing IC packaging and bumping
SawStreet operates out of a class 100 clean room with automated equipment (ie. Dicing Saw, Pick and Place). Owners have been in working in the electronics business for a combined total of 40 years plus.

Keywords

  • Wafer Processing
  • Wafer Dicing
  • Pick And Place
  • Dicing Wafers
  • Quick Turn
  • Wafer Grinding
  • Die Pick And Place
  • Backend Services
  • Gaas Wafer Process
  • Reticle Dicing
  • Quick Turn Process
  • Si Wafer Processing
  • Wafer Thinning
  • Die Inspection

NAICS Code(s)

334413
Semiconductor and Related Device Manufacturing

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